BUK213-50Y Datasheet, PDF (13/16 Pages) NXP Semiconductors – Single channel high-side TOPFET

Philips Semiconductors
BUK208-50Y; BUK213-50Y
Single channel high-side TOPFET™
Plastic single-ended package; heatsink mounted; 1 mounting hole;
5-lead TO-220 lead form option
E
p1
∅p
q
D1
D
A
A1
mounting
base
SOT263B-01
L
m
1
e
L3
L4
5
b
wM
R
L1
L2
R
Q
c
Q1
Q2
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A A1 b
c
D D1 E
e
L
L1
L2
L3⁽¹⁾
L4⁽²⁾
max.
m
∅ p p1
q
Q Q1 Q2 R
w
mm
4.5
4.1
1.39 0.85
1.27 0.70
0.7
0.4
15.8
15.2
6.4
5.9
10.3
9.7
1.7
9.8
9.7
5.9
5.3
5.2
5.0
2.4
1.6
0.5
0.8
0.6
3.8
3.6
4.3
4.1
3.0
2.7
2.0
4.5
8.2
0.5
0.4
Notes
1. Terminal dimensions are uncontrolled in this zone.
2. Positional accuracy of the terminals is controlled in this zone.
OUTLINE
VERSION
SOT263B-01
REFERENCES
IEC
JEDEC
EIAJ
5-lead (option)
TO-220
EUROPEAN
PROJECTION
ISSUE DATE
01-01-11
Refer to mounting instructions for TO-220 packages. Epoxy meets UL94 VO at 1/8’’. Net mass: 2g
Fig 18. SOT263B-01.
9397 750 09384
Product data
Rev. 02 — 06 June 2002
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
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