BUK213-50Y Datasheet, PDF (12/16 Pages) NXP Semiconductors – Single channel high-side TOPFET

Philips Semiconductors
9. Package outline
BUK208-50Y; BUK213-50Y
Single channel high-side TOPFET™
Plastic single-ended surface mounted package (Philips version of D²-PAK); 5 leads
(one lead cropped)
SOT426
E
D1
D
HD
3
1
24
5
b
eeee
A
A1
mounting
base
Lp
c
Q
0
2.5 5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A
A1
b
c
D
max.
D1
mm ^{4.50 1.40 0.85 0.64}
4.10 1.27 0.60 0.46
11
1.60
1.20
E
10.30
9.70
e
1.70
Lp
HD
Q
2.90 15.80 2.60
2.10 14.80 2.20
OUTLINE
VERSION
IEC
SOT426
REFERENCES
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
98-12-14
99-06-25
Epoxy meets UL94 V0 at 1/8’’. Net mass: 1.5g. For soldering guidelines and surface mount footprint design, please refer to
Data Handbook SC18.
Fig 17. SOT426.
9397 750 09384
Product data
Rev. 02 — 06 June 2002
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
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