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PMN42XPEA_15 Datasheet, PDF (11/15 Pages) NXP Semiconductors – 20 V, P-channel Trench MOSFET | |||
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NXP Semiconductors
13. Soldering
3.45
1.95
0.95
3.3 2.825
0.95
0.45 0.55
(6Ã) (6Ã)
0.7
(6Ã)
0.8
(6Ã)
2.4
Fig. 19. Reflow soldering footprint for TSOP6 (SOT457)
5.3
1.475
5.05
1.475
1.5
(4Ã)
0.45
(2Ã)
1.45
(6Ã)
2.85
Fig. 20. Wave soldering footprint for TSOP6 (SOT457)
PMN42XPEA
20 V, P-channel Trench MOSFET
solder lands
solder resist
solder paste
occupied area
Dimensions in mm
sot457_fr
solder lands
solder resist
occupied area
Dimensions in mm
preferred transport
direction during soldering
sot457_fw
PMN42XPEA
Product data sheet
All information provided in this document is subject to legal disclaimers.
21 March 2014
© NXP Semiconductors N.V. 2014. All rights reserved
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