BUK6213-30A Datasheet, PDF (10/13 Pages) NXP Semiconductors – TrenchMOS Intermediate level FET

Philips Semiconductors
BUK6213-30A
TrenchMOS™ Intermediate level FET
7. Package outline
Plastic single-ended surface mounted package (Philips version of D-PAK); 3 leads
(one lead cropped)
SOT428
seating plane
y
A
E
A
A2
b2
A1
E1
mounting
base
D1
D
HE
L2
2
L
L1
1
3
b1
b
wM A
c
e
e1
0
10 20 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A A1⁽¹⁾ A2 b
b1 b2
c
D
D1 _E
min.
E1 e
e1 HE
L
L1
min.
L2
mm ^{2.38 0.65 0.93 0.89}
2.22 0.45 0.73 0.71
1.1
0.9
5.46
5.26
0.4
0.2
6.22
5.98
4.0
6.73 4.81 _{2.285 4.57} 10.4 2.95
6.47 4.45
9.6 2.55
0.5
0.9
0.5
Note
1. Measured from heatsink back to lead.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
EUROPEAN
PROJECTION
SOT428
TO-252
SC-63
w
y
max.
0.2 0.2
ISSUE DATE
99-09-13
01-12-11
Fig 16. SOT428 (D-PAK).
9397 750 12028
Product data
Rev. 02 — 22 September 2003
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
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