BUJ303CD_15 Datasheet, PDF (10/13 Pages) NXP Semiconductors – NPN power transistor

NXP Semiconductors
7. Package outline
Plastic single-ended surface-mounted package (DPAK); 3 leads (one lead cropped)
BUJ303CD
NPN power transistor
SOT428
E
A
b₂
y
A
A₁
D₁
H_D
mounting
base
L₂
b₁
2
1
L
3
b
e
e₁
wM A
L₁
c
E₁
D₂
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A
A₁
b
b₁
b₂
c
D₁
D₂
min
E
E₁
min
e
e₁
H_D
L
L₁
min
L₂
mm
2.38
2.22
0.93
0.46
0.89
0.71
1.1
0.9
5.46 0.56 6.22
5.00 0.20 5.98
4.0
6.73
6.47
4.45 2.285 4.57
10.4
9.6
2.95
2.55
0.5
0.9
0.5
w
y
max
0.2 0.2
OUTLINE
VERSION
IEC
SOT428
REFERENCES
JEDEC
JEITA
TO-252
SC-63
Fig. 17. Package outline DPAK (SOT428)
BUJ303CD
Product data sheet
All information provided in this document is subject to legal disclaimers.
8 November 2012
EUROPEAN
PROJECTION
ISSUE DATE
06-02-14
06-03-16
© NXP B.V. 2012. All rights reserved
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