PYTHON25K Datasheet, PDF (81/87 Pages) ON Semiconductor – PYTHON 25K/16K/12K/10K Global Shutter CMOS Image Sensors

NOIP1SN025KA, NOIP1SN016KA, NOIP1SN012KA, NOIP1SN010KA
Mechanical Specifications
Table 32. MECHANICAL SPECIFICATIONS
Parameter
Description
Die
Die thickness
Die size
Die center, X offset to the center of package
Die center, Y offset to the center of the package
Die position, tilt to the Die Attach Plane
Die rotation accuracy (referenced to die scribe and lead
fingers on package on all four sides)
Optical center referenced from the die/package center (X-dir)
Optical center referenced from the die/package center (Y-dir)
Distance from bottom of the package to top of the die surface
Distance from top of the die surface to top of the glass lid
Glass Lid
Specification
XY size
Thickness
Spectral response range
Transmission of glass lid (refer to Figure 44)
Glass Lid Material
D263 Teco (no coatings on glass)
Mechanical Shock
JESD22-B104C; Condition G
Vibration
JESD22-B103B; Condition 1
Mounting Profile
Pb−free wave soldering profile for pin grid array package
Recommended
Socket
Andon Electronics Corporation (www.andonelectronics.com)
Min
Typ
Max
Units
725
25.5 x 32.5
mm
mm²
-50
0
50
mm
-50
0
50
mm
−1
0
1
deg
−1
0
1
deg
1.605
1.075
400
0
3602
1.80
1.45
32.47 x 39.4
0.7
92
1.995
1.855
1000
mm
mm
mm
mm
mm²
mm
nm
%
2000
g
2000
Hz
10−31−13A−355−400T4−R27−L14
NOTE: Optical center min/max tolerance is calculated on X/Y package tolerances with package center as a reference.
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