SE98A Datasheet, PDF (35/43 Pages) NXP Semiconductors – DDR memory module temp sensor, 1.7 V to 3.6 V

NXP Semiconductors
SE98A
DDR memory module temp sensor, 1.7 V to 3.6 V
12. Package outline
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 4.4 mm
SOT530-1
D
c
y
Z
8
5
E
A
X
HE
vM A
pin 1 index
A2
A1
1
e
4
bp
wM
(A3)
A
θ
Lp
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D⁽¹⁾ E⁽²⁾
e
HE
L
Lp
mm
1.1
0.15
0.05
0.95
0.85
0.25
0.30
0.19
0.20
0.13
3.1
2.9
4.5
4.3
0.65
6.5
6.3
0.94
0.7
0.5
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
SOT530-1
MO-153
v
w
y
Z⁽¹⁾
θ
0.1
0.1
0.1
0.70
0.35
8°
0°
EUROPEAN
PROJECTION
ISSUE DATE
00-02-24
03-02-18
Fig 28. Package outline SOT530-1 (TSSOP8)
SE98A_2
Product data sheet
Rev. 02 — 6 August 2009
© NXP B.V. 2009. All rights reserved.
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