SE98A Datasheet, PDF (2/43 Pages) NXP Semiconductors – DDR memory module temp sensor, 1.7 V to 3.6 V

NXP Semiconductors
SE98A
DDR memory module temp sensor, 1.7 V to 3.6 V
I Operating current: 250 µA (typ.) and 400 µA (max.)
I Programmable hysteresis threshold: 0 °C, 1.5 °C, 3 °C, 6 °C
I Over/under/critical temperature EVENT output
I B grade accuracy:
N ±0.5 °C/±1 °C (typ./max.) → +75 °C to +95 °C
N ±1 °C/±2 °C (typ./max.) → +40 °C to +125 °C
N ±2 °C/±3 °C (typ./max.) → −40 °C to +125 °C
I ESD protection exceeds 2000 V HBM per JESD22-A114, 250 V MM per
JESD22-A115, and 1000 V CDM per JESD22-C101
I Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA
I Available packages: TSSOP8, HWSON8 (PSON8 VCED-3) and HXSON8
3. Applications
I DDR2 and DDR3 memory modules
I Laptops, personal computers and servers
I Enterprise networking
I Hard disk drives and other PC peripherals
4. Ordering information
Table 1. Ordering information
Type number Topside
mark
Package
Name
SE98APW
S98A
TSSOP8
SE98ATP^[1]
98A
HWSON8
SE98ATL
8AL
HXSON8
Description
plastic thin shrink small outline package; 8 leads;
body width 4.4 mm
plastic thermal enhanced very very thin small outline package;
no leads; 8 terminals; body 2 × 3 × 0.8 mm
plastic thermal enhanced extremely thin small outline package;
no leads; 8 terminals; body 2 × 3 × 0.5 mm
Version
SOT530-1
SOT1069-1
SOT1052-1
[1] Industry standard 2 mm × 3 mm × 0.8 mm package to JEDEC VCED-3 PSON8 in 8 mm × 4 mm pitch tape 4 k quantity reels.
SE98A_2
Product data sheet
Rev. 02 — 6 August 2009
© NXP B.V. 2009. All rights reserved.
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