PMN35EN Datasheet, PDF (11/15 Pages) NXP Semiconductors – 30 V, 5.1 A N-channel Trench MOSFET

NXP Semiconductors
10. Soldering
3.45
1.95
PMN35EN
30 V, 5.1 A N-channel Trench MOSFET
0.95
3.3 2.825
0.95
0.45 ^0.55
(6×) ^(6×)
0.7
(6×)
0.8
(6×)
2.4
Fig 19. Reflow soldering footprint for SOT457 (TSOP6)
5.3
solder lands
solder resist
solder paste
occupied area
Dimensions in mm
sot457_fr
1.475
5.05
1.475
1.5
(4×)
0.45
(2×)
1.45
(6×)
2.85
Fig 20. Wave soldering footprint for SOT457 (TSOP6)
solder lands
solder resist
occupied area
Dimensions in mm
preferred transport
direction during soldering
sot457_fw
PMN35EN
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 20 July 2011
© NXP B.V. 2011. All rights reserved.
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