DS92LV0411 Datasheet, PDF(36/40 Page) National Semiconductor (TI) – 5 - 50 MHz Channel Link II Serializer/Deserializer with LVDS Parallel Interface

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DS92LV0411 Datasheet, PDF (36/40 Pages) National Semiconductor (TI) – 5 - 50 MHz Channel Link II Serializer/Deserializer with LVDS Parallel Interface

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TABLE 15. Deserializer Alternate Color / Data Mapping

Channel Link

TxOUT3

TxOUT2

TxOUT1

TxOUT0

Bit Number

Bit 26

Bit 25

Bit 24

Bit 23

Bit 22

Bit 21

Bit 20

Bit 19

Bit 18

Bit 17

Bit 16

Bit 15

Bit 14

Bit 13

Bit 12

Bit 11

Bit 10

Bit 9

Bit 8

Bit 7

Bit 6

Bit 5

Bit 4

Bit 3

Bit 2

Bit 1

Bit 0

N/A

RGB (LSB

Example)

DS92LV0412

Settings

MAPSEL = 0

DS92LV2411 DS90UR241 DS99R421Q DS90C241

B6ROUT10

N/A

CONFIG [1:0] = 00

N/A

DIN20

RxIN2

DIN19

DIN18

DIN17

DIN16

DIN15

DIN14

DIN13

RxIN1

DIN12

DIN11

DIN10

DIN9

DIN8

DIN7

DIN6

RxIN0

DIN5

DIN4

DIN3

DIN2

DIN1

DIN0

DIN923

OS2

DIN922

OS1

DIN921

OS0

CONFIG [1:0] = 10

DIN20

DIN19

DIN18

DIN17

DIN16

DIN15

DIN14

DIN13

DIN12

DIN11

DIN10

DIN9

DIN8

DIN7

DIN6

DIN5

DIN4

DIN3

DIN2

DIN1

DIN0

DIN923

DIN922

DIN921

CONFIG [1:0] = 11

PCB LAYOUT AND POWER SYSTEM CONSIDERATIONS

Circuit board layout and stack-up for the LVDS devices should

be designed to provide low-noise power feed to the device.

Good layout practice will also separate high frequency or

high-level inputs and outputs to minimize unwanted stray

noise pickup, feedback and interference. Power system per-

formance may be greatly improved by using thin dielectrics (2

to 4 mils) for power / ground sandwiches. This arrangement

provides plane capacitance for the PCB power system with

low-inductance parasitics, which has proven especially effec-

tive at high frequencies, and makes the value and placement

of external bypass capacitors less critical. External bypass

capacitors should include both RF ceramic and tantalum elec-

trolytic types. RF capacitors may use values in the range of

0.01 uF to 0.1 uF. Tantalum capacitors may be in the 2.2 uF

to 10 uF range. Voltage rating of the tantalum capacitors

should be at least 5X the power supply voltage being used.

Surface mount capacitors are recommended due to their

smaller parasitics. When using multiple capacitors per supply

pin, locate the smaller value closer to the pin. A large bulk

capacitor is recommend at the point of power entry. This is

typically in the 50uF to 100uF range and will smooth low fre-

quency switching noise. It is recommended to connect power

and ground pins directly to the power and ground planes with

bypass capacitors connected to the plane with via on both

ends of the capacitor. Connecting power or ground pins to an

external bypass capacitor will increase the inductance of the

path.

A small body size X7R chip capacitor, such as 0603, is rec-

ommended for external bypass. Its small body size reduces

the parasitic inductance of the capacitor. The user must pay

attention to the resonance frequency of these external bypass

capacitors, usually in the range of 20-30 MHz. To provide ef-

fective bypassing, multiple capacitors are often used to

achieve low impedance between the supply rails over the fre-

quency of interest. At high frequency, it is also a common

practice to use two vias from power and ground pins to the

planes, reducing the impedance at high frequency.

Some devices provide separate power and ground pins for

different portions of the circuit. This is done to isolate switch-

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