LP3910SQ-AN Datasheet, PDF (12/60 Pages) National Semiconductor (TI) – Power Management IC for Hard Drive Based Portable Media Players

ADC Electrical Characteristics
External components:
Symbol
Parameter
Conditions
V_REF
Reference Voltage
T = 25°C
T = 0°C to +125°C
INL
DNL
V_{GP_IN}
Core ADC Integral Non-linearity
Core ADC Differential Non-linearity
General Purpose ADC Input Voltage
Range
V_REF = 1.225 (Note 9)
V_REF = 1.225 (Note 9)
VBATT,
Battery Max Voltage Scalar Output
VBATT = 3.5V
RANGE 0
V_BATT,
RANGE 1
V_ISENSE
RANGE 0
V_ISENSE
RANGE 1
ADC1 &
ADC2 _MIN
ADC1 &
ADC2_MAX
t_CONV
t_WARM
Battery Min Voltage Scalar Output
VBATT = 2.6V
Battery Max Voltage Scalar Output
VBATT = 4.4V
Battery Min Voltage Scalar Output
V_REF = 2.6V
ISENSE Max Voltage Scalar Output
V_ISENSE = 0.6463V
(I_CHG = 0.605A,
R_SENSE = 4.64 kΩ)
ISENSE Min Voltage Scalar Output
V_ISENSE = 0V
(I_CHG = 0A,
R_SENSE = 4.64 kΩ)
ISENSE Max Voltage Scalar Output
V_ISENSE = 1.175V
(I_CHG = 1.1A,
R_SENSE = 4.64 kΩ)
ISENSE Min Voltage Scalar Output
V_ISENSE = 0V (I_CHG = 0A,
R_SENSE = 4.64 kΩ)
ADC1 & ADC2 Min Voltage Scalar Output V_REFH = 1.225
ADC1 & ADC2 Max Voltage Scalar
Output
Conversion Time
Warm-up Time
V_REFH = 1.225
(Note 9)
Min
1.220
1.200
-1
-0.5
V_REF
2.435
1.217
2.435
1.217
Typ
1.225
1.225
2.45
1.225
2.45
1.225
Max
1.230
1.230
1
0.5
Units
V
V
LSB
LSB
2·V_REF
V
2.465
V
1.232
V
2.465
V
1.232
V
2.373 2.45 2.519
V
1.186 1.225 1.260
V
2.373 2.45 2.519
V
1.186 1.225 1.260
V
1.218 1.225 1.230
V
2.436 2.45 2.46
V
5
ms
2
ms
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation
of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions,
see the Electrical Characteristics tables.
Note 2: All voltages are with respect to the potential at the GND pin.
Note 3: Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T_J = 160°C (typ.) and disengages at T_J
= 140°C (typ.).
Note 4: The Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF capacitor discharged
directly into each pin. MIL-STD-883 3015.7.
Note 5: In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be
derated. Maximum ambient temperature (T_A-MAX) is dependent on the maximum operating junction temperature (T_J-MAX-OP = 125°C), the maximum power
dissipation of the device in the application (P_D-MAX), and the junction-to-ambient thermal resistance of the part/package in the application (θ_JA), as given by the
following equation: T_A-MAX = T_J-MAX-OP − (θ_JA × P_D-MAX).
Note 6: Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists,
special care must be paid to thermal dissipation issues in board design.
Note 7: Min and Max limits are guaranteed by design, test, or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm.
Note 8: Low ESR Surface-Mount Ceramic Capacitors (MLCCs) are used in setting electrical characteristics.
Note 9: Specifications guaranteed by design. Not tested during production.
Note 10: Typical values and limits appearing in normal type for T_J = 25°C. Limits appearing in boldface type apply over the entire junction temperature range
for operation, −40°C to +125°C.
Note 11: LDO2EN, BUCK1EN, and USBSUSP have weak internal pull downs while pins POWERACK, ONOFF do not have this.
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