UPD784907 Datasheet, PDF (90/98 Pages) NEC – 16-BIT SINGLE-CHIP MICROCONTROLLER

µPD784907, 784908
17. RECOMMENDED SOLDERING CONDITIONS
The µPD784908 should be soldered under the following recommended conditions.
For details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting
Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact your NEC sales represen-
tative.
Table 17-1. Soldering Conditions for Surface Mount Type
µPD784907GF-×××-3BA: 100-pin plastic QFP (14 × 20 mm)
µPD784908GF-×××-3BA: 100-pin plastic QFP (14 × 20 mm)
Soldering Method
Soldering Conditions
Infrared reflow
VPS
Wave soldering
Partial heating method
Package peak temperature: 235°C
Time: 30 seconds max. (210°C or higher)
Count: three times or less
Package peak temperature: 215°C
Time: 40 seconds or max. (200°C or higher)
Count: three times or less
Solder bath temperature: 260°C max.
Time: 10 seconds max.
Count : 1
Preheating temperature: 120°C max. (package surface temperature)
Pin temperature: 300°C
Time: 3 seconds max. (per pin row)
Recommended Condition
Symbol
IR35-00-3
VP15-00-3
WS60-00-1
—
Caution Do not use different soldering methods together (except for partial heating).
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Data Sheet U11680EJ2V0DS00