UPD784218 Datasheet, PDF (83/92 Pages) NEC – 16-/8-BIT SINGLE-CHIP MICROCONTROLLERS

µPD784218, 784218Y
17. RECOMMENDED SOLDERING CONDITIONS
The µPD784218 should be soldered and mounted under the following recommended conditions. For the details
of the recommended soldering conditions, refer to the document Semiconductor Device Mounting Technology
Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact your NEC sales representative.
Caution Soldering conditions for the µPD784218YGC-×××-8EU and µPD784218YGF-×××-3BA are undetermined
because these products are under development.
Table 17-1. Soldering Conditions for Surface Mount Type
(1) µPD784218GC-×××-8EU: 100-pin plastic LQFP (Fine pitch) (14 × 14 mm)
Soldering Method
Soldering Conditions
Infrared reflow
VPS
Partial heating
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or
higher), Count: Two times or less, Exposure limit: 7 days^Note (after that,
prebake at 125°C for 10 hours)
Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or
higher), Count: Two times or less, Exposure limit: 7 days^Note (after that,
prebake at 125°C for 10 hours)
Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
Recommended
Condition Symbol
IR35-107-2
VP-15-107-2
—
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
(2) µPD784218GF-×××-3BA: 100-pin plastic QFP (14 × 20 mm)
Soldering Method
Infrared reflow
VPS
Wave soldering
Partial heating
Soldering Conditions
Recommended
Condition Symbol
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or
higher), Count: Two times or less
IR35-00-2
Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or
higher), Count: Two times or less
VP15-00-2
Solder bath temperature: 260°C max., Time: 10 seconds max., Count: Once, WS60-00-1
Preheating temperature: 120°C max. (package surface temperature)
Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
—
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet U12304EJ2V0DS00
83