UPD78361A Datasheet, PDF (76/88 Pages) NEC – 16/8-BIT SINGLE-CHIP MICROCONTROLLER

µPD78361A, 78362A
11. RECOMMENDED SOLDERING CONDITIONS
These products should be soldered and mounted under the conditions recommended below.
For details of recommended soldering conditions, refer to the information document Semiconductor Device
Mounting Technology Manual (C10535E).
For soldering methods and conditions other than those recommended, please contact your NEC sales
representative.
Table 11-1. Insertion Type Soldering Conditions
µPD78361ACW-×××: 64-pin plastic shrink DIP (750 mil)
µPD78362ACW-×××: 64-pin plastic shrink-DIP (750 mil)
Soldering method
Soldering conditions
Wave soldering
(pin only)
Partial heating
Solder bath temperature: 260 ˚C or less, Time: 10 sec. max.,
Pin temperature: 300 ˚C or less, Time: 3 sec. max. (per pin)
Caution Wave soldering is only for the pins in order that jet solder cannot contact with the chip
directly.
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