MMC2080 Datasheet, PDF (9/34 Pages) Motorola, Inc – Integrated Processor with Roaming FLEX Decoder

MMC2080/2075 Pin Descriptions
Part 2 Signal and Connection Descriptions
The pins and signals of the MMC2080/2075 are described in the following sections. Figure 3 on page 10
and Figure 4 on page 11 are top and bottom views, respectively, of the 12 mm x 12 mm MAP Ball Grid
Array (BGA) package, and Figure 5 on page 12 and Figure 6 on page 13 are top and bottom views,
respectively, of the 43 mm x 43 mm ceramic Pin Grid Array (PGA) package, showing the pin-outs. Table 4
on page 14 and Table 5 on page 17 list the pins by number and signal name.
Figure 7 on page 21 is a representational pin-out of the chip, grouping the signals by their function. Table 6
on page 20 identifies the number of signals for each group and refers to Table 8 on page 23 through Table 20
on page 27, which are organized according to signal type and give a brief description of each signal pin.
2.1 MMC2080/2075 Pin Descriptions
The following section provides information about the available packages for this product, including
diagrams of the package pin-outs and tables describing how the signals of the MMC2080/2075 are allocated.
There are two packages for each part:
• The 144-pin I/O, STD small ball (SMBALL) mold array process (MAP) ball grid array (BGA),
12 mm x 12 mm package. Table 4 on page 14 identifies the signal associated with each pin.
• The 208-pin I/O, PGA, 43 mm x 43 mm ceramic package. Table 5 on page 17 identifies the signal
associated with each pin.
Signal and Connection Descriptions
9
Preliminary