MMC2080 Datasheet, PDF (29/34 Pages) Motorola, Inc – Integrated Processor with Roaming FLEX Decoder

BGA Details
Part 4 Pin-out and Package Information
This section provides information about the available packages for this product. The MMC2080/2075 is
available in a 144-pin Ball Grid Array (BGA) package. A 208-pin Pin Grid Array (PGA) is produced for
engineering use only. Contact the factory for availability.
4.1 BGA Details
The MMC2080/2075 is offered in the JEDEC-standard, Mold Array Process (MAP), 12 mm x 12 mm BGA
with 0.8 mm ball pitch (0.4 mm small solder balls). Refer to Figure 8 for the package drawings and
dimensions.
4.1.1 BGA Package Mechanical Drawings
The mechanical drawings for the 144-pin Ball Grid Array package are shown in Figure 8.
X
D
Y
LASER MARK FOR PIN 1
IDENTIFICATION IN
THIS AREA
DETAIL K
M
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
3. DIMENSION b IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER, PARALLEL TO DATUM
PLANE Z.
E
4. DATUM Z (SEATING PLANE) IS DEFINED BY THE
SPHERICAL CROWNS OF THE SOLDER BALLS.
5. PARALLELISM MEASUREMENT SHALL EXCLUDE ANY
EFFECT OF MARK ON TOP SURFACE OF PACKAGE.
0.15
13 12 11 10 9 8
12X e
54321
M
METALIZED MARK
FOR PIN 1 IDENTIFICATION
IN THIS AREA
MILLIMETERS
DIM MIN MAX
A 1.25 1.60
A1 0.18 0.34
A2
1.16 REF
b 0.35 0.45
D
12.00 BSC
E
12.00 BSC
e
0.80 BSC
A
B
C
D
E
F
G
H
J
K
L
M
N
3
144X b
0.15 Z X Y ^{VIEW M-M}
0.08 Z
A ^A2
5
0.20 Z
A1
Z4
0.10 Z
DETAIL K
ROTATED 90_° CLOCKWISE
Figure 8. MMC2080/2075 BGA Mechanical Drawings
Pin-out and Package Information
29
Preliminary