MT16LSDF6464HY-133D2 Datasheet, PDF (7/22 Pages) Micron Technology – SMALL-OUTLINE SDRAM MODULE

General Description
The MT16LSDF3264(L)H and MT16LSDF6464(L)H
are high-speed CMOS, dynamic random-access
256MB and 512MB unbuffered memory modules,
organized in x64 configurations. These modules use
internally configured quad-bank SDRAMs with a syn-
chronous interface (all signals are registered on the
positive edge of the clock signal CK).
Read and write accesses to the SDRAM modules are
burst oriented; accesses start at a selected location and
continue for a programmed number of locations in a
programmed sequence. Accesses begin with the regis-
tration of an ACTIVE command, which is then fol-
lowed by a READ or WRITE command. The address
bits registered coincident with the ACTIVE command
are used to select the device bank and row to be
accessed (BA0, BA1 select the device bank, A0–A11
[256MB] or A0–A12 [512MB] select the device row).
The address bits A0–A9 (for both 256MB and 512MB
modules) registered coincident with the READ or
WRITE command are used to select the starting device
column location for the burst access.
These modules provide for programmable READ or
WRITE burst lengths of 1, 2, 4, or 8 locations, or the full
page, with a burst terminate option. An auto precharge
function may be enabled to provide a self-timed row
precharge that is initiated at the end of the burst
sequence.
These modules use an internal pipelined architec-
ture to achieve high-speed operation. This architec-
ture is compatible with the 2n rule of prefetch
architectures, but it also enables the column address
to be changed on every clock cycle to achieve a high-
speed, fully random access. Precharging one device
bank while accessing one of the other three device
banks will hide the precharge cycles and provide
seamless, high-speed, random-access operation.
These modules are designed to operate in 3.3V, low-
power memory systems. An auto refresh mode is pro-
vided, along with a power-saving, power-down mode.
All inputs and outputs are LVTTL-compatible.
SDRAM modules offer substantial advances in
DRAM operating performance, including the ability to
synchronously burst data at a fast data rate with auto-
matic column-address generation, the ability to inter-
leave between internal banks in order to hide
precharge time and the capability to randomly change
column addresses on each clock cycle during a burst
access. For more information regarding SDRAM opera-
tion, refer to the 128Mb or 256Mb SDRAM component
data sheets.
256MB, 512MB (x64, DR)
144-PIN SDRAM SODIMM
Serial Presence Detect Operation
These modules incorporate serial presence-detect
(SPD). The SPD function is implemented using a
2,048-bit EEPROM. This nonvolatile storage device
contains 256 bytes. The first 128 bytes are programmed
by Micron to identify the module type, SDRAM charac-
teristics and module timing parameters. The remain-
ing 128 bytes of storage are available for use by the
customer. System READ/WRITE operations between
the master (system logic) and the slave EEPROM
device (DIMM) occur via a standard I²C bus using the
DIMM’s SCL (clock) and SDA (data) signals, together
with SA[2:0], which provide eight unique DIMM/
EEPROM addresses. Write protect (WP) is tied to
ground on the module, permanently disabling hard-
ware write protect.
Initialization
SDRAMs must be powered up and initialized in a
predefined manner. Operational procedures other
than those specified may result in undefined opera-
tion. When power is applied to VDD and VDDQ (simul-
taneously), and the clock is stable (stable clock is
defined as a signal cycling within timing constraints
specified for the clock pin), the SDRAM requires a
100µs delay prior to issuing any command other than a
COMMAND INHIBIT or NOP. Starting at some point
during this 100µs period and continuing at least
through the end of this period, COMMAND INHIBIT
or NOP commands should be applied.
When the 100µs delay has been satisfied with at
least one COMMAND INHIBIT or NOP command hav-
ing been applied, a PRECHARGE command should be
applied. All device banks must then be precharged,
thereby placing the device in the all banks idle state.
When in the idle state, two AUTO REFRESH cycles
must be performed. After the AUTO REFRESH cycles
are complete, the SDRAM is ready for mode register
programming. Because the mode register will power
up in an unknown state, it should be loaded prior to
applying any operational command.
Mode Register Definition
The mode register is used to define the specific
mode of operation of the SDRAM. This definition
includes the selection of a burst length, a burst type, a
CL, an operating mode, and a write burst mode, as
shown in Figure 4 on page 8. The mode register is pro-
grammed via the LOAD MODE REGISTER command
and will retain the stored information until it is pro-
grammed again or the device loses power.
pdf: 09005aef807924d2, source: 09005aef807924f1
SDF16C32_64x64HG.fm - Rev. E 4/06 EN
7
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©2006 Micron Technology, Inc. All rights reserved.