MT41J256M8 Datasheet, PDF (28/211 Pages) Micron Technology – MT41J512M4 – 64 Meg x 4 x 8 Banks

Thermal Characteristics
2Gb: x4, x8, x16 DDR3 SDRAM
Thermal Characteristics
Table 7: Thermal Characteristics
Parameter/Condition
Operating case temperature –
Commercial
Operating case temperature –
Industrial
Operating case temperature –
Automotive
Junction-to-case
(TOP)
96-ball (JT)
96-ball (HA)
78-ball (DA) M, K
78-ball (HX)
Value
0 to +85
0 to +95
–40 to +85
–40 to +95
–40 to +85
–40 to +105
6.5
3.9
6.5
3.9
Unit
°C
°C
°C
°C
°C
°C
°C/W
Symbol
T_C
T_C
T_C
T_C
T_C
T_C
ΘJC
Notes
1, 2, 3
1, 2, 3, 4
1, 2, 3
1, 2, 3, 4
1, 2, 3
1, 2, 3, 4
5
Notes:
1. Maximum operating case temperature. T_C is measured in the center of the package.
2. A thermal solution must be designed to ensure the DRAM device does not exceed T_C
MAX during operation.
3. Device functionality is not guaranteed if the DRAM device exceeds T_C MAX during oper-
ation.
4. If T_C exceeds 85°C, the DRAM must be refreshed externally at 2x refresh, which is a 3.9μs
interval refresh rate. The use of SRT or ASR (if available) must be enabled.
5. Thermal resistance data is based on a number of samples from multiple lots and should
be viewed as a typical number.
PDF: 09005aef826aaadc
2Gb_DDR3_SDRAM.pdf - Rev. Q 04/13 EN
28
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