MT47H64M16BT-37EA Datasheet, PDF (20/134 Pages) Micron Technology – DDR2 SDRAM

Figure 9: 60-Ball FBGA Package (8mm x 11.5mm) – x4, x8
1Gb: x4, x8, x16 DDR2 SDRAM
Packaging
Seating
plane
0.12 A
A
60X Ø0.45
Dimensions apply to
solder balls post-
reflow on Ø0.35
SMD ball pads.
987
8 CTR
0.8 TYP
0.8 ±0.1
321
Ball A1 ID
A
B
C
D
E
F 11.5 ±0.1
G
H
J
K
L
Ball A1 ID
0.8 TYP
6.4 CTR
8 ±0.1
Exposed
gold-plated pad
1.0 MAX X 0.7
nonconductive
floating pad
1.2 MAX
0.25 MIN
Notes: 1. All dimensions are in millimeters.
2. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu) or leaded Eutectic (62% Sn,
36%Pb, 2% Ag).
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. V 6/10 EN
20
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© 2004 Micron Technology, Inc. All rights reserved.