MT46V64M8P-5BF Datasheet, PDF (2/93 Pages) Micron Technology – 512Mb: x4, x8, x16 Double Data Rate (DDR) SDRAM SDRAM Features

512Mb: x4, x8, x16 DDR SDRAM
Features
Table 2: Addressing
Parameter
Configuration
Refresh count
Row address
Bank address
Column address
128 Meg x 4
32 Meg x 4 x 4 banks
8K
8K (A0–A12)
4 (BA0, BA1)
4K (A0–A9, A11, A12)
64 Meg x 8
16 Meg x 8 x 4 banks
8K
8K (A0–A12)
4 (BA0, BA1)
2K (A0-A9, A11)
32 Meg x 16
8 Meg x 16 x 4 banks
8K
8K (A0–A12)
4 (BA0, BA1)
1K (A0–A9)
Table 3: Speed Grade Compatibility
Marking
-5B¹
-6
-6T
-75E
-75Z
-75
PC3200 (3-3-3) PC2700 (2.5-3-3) PC2100 (2-2-2) PC2100 (2-3-3) PC2100 (2.5-3-3) PC1600 (2-2-2)
Yes
Yes
Yes
Yes
Yes
Yes
–
Yes
Yes
Yes
Yes
Yes
–
Yes
Yes
Yes
Yes
Yes
–
–
Yes
Yes
Yes
Yes
–
–
–
Yes
Yes
Yes
–
–
–
–
Yes
Yes
-5B
-6/-6T
-75E
-75Z
-75
-75
Notes: 1. The -5B device is backward compatible with all slower speed grades. The voltage range of
-5B device operating at slower speed grades is V_DD = V_DDQ = 2.5V ± 0.2V.
Figure 1: 512Mb DDR SDRAM Part Numbers
MT46V
Example Part Number: MT46V32M16P-6T:F
Configuration
-
:
Package
Speed
Sp.
Op.
Temp.
Revision
Configuration
128 Meg x 4 128M4
64 Meg x 8 64M8
32 Meg x 16 32M16
Package
400-mil TSOP
TG
400-mil TSOP (Pb-free)
P
10mm x 12.5mm FBGA
FN
10mm x 12.5mm FBGA (Pb-free) BN
8mm x 12.5mm FBGA
CV
8mm x 12.5mm FBGA (Pb-free) CY
Revision
:F x4, x8, x16
:J x4, x8, x16
Operating Temp
Commercial
IT Industrial
Special Options
Standard
L Low power
Speed Grade
-5B ^tCK = 5ns, CL = 3
-6 ^tCK = 6ns, CL = 2.5
-6T ^tCK = 6ns, CL = 2.5
FBGA Part Number System
Due to space limitations, FBGA-packaged components have an abbreviated part
marking that is different from the part number. For a quick conversion of an FBGA code,
see the FBGA Part Marking Decoder on Micron’s Web site: www.micron.com.
PDF: 09005aef80a1d9d4/Source: 09005aef82a95a3a
512Mb_DDR_x4x8x16_D1.fm - 512Mb DDR: Rev. Q; Core DDR Rev. E 7/11 EN
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