MT29F8G08ADADAH4D Datasheet, PDF (14/132 Pages) Micron Technology – 4Gb, 8Gb, 16Gb: x8, x16 NAND Flash Memory Features

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4Gb, 8Gb, 16Gb: x8, x16 NAND Flash Memory
Package Dimensions
Figure 7: 63-Ball VFBGA (9mm x 11mm)
Seating
plane
A
0.1 A
63X Ø0.45
Dimensions apply
to solder balls post-
reflow on Ø0.4 SMD
ball pads.
Solder ball material:
SAC305 (96.5% Sn,
3% Ag, 0.5% Cu).
10 9 8 7 6 5 4 3 2 1
8.8 CTR
0.8 TYP
Ball A1 ID
(covered by SR)
A
B
C
D
E
F
G ^{11 ±0.1}
H
J
K
L
M
0.8 TYP
7.2 CTR
9 ±0.1
Note: 1. All dimensions are in millimeters.
1.0 MAX
0.25 MIN
Ball A1 ID
PDF: 09005aef83b25735
m60a_4gb_8gb_16gb_ecc_nand.pdf - Rev. N 10/12 EN
14
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