PIC24HJ32GP302_12 Datasheet, PDF (347/390 Pages) Microchip Technology – 16-bit Microcontrollers (up to 128 KB Flash and 8K SRAM) with Advanced Analog

PIC24HJ32GP302/304, PIC24HJ64GPX02/X04 AND PIC24HJ128GPX02/X04
TABLE 29-4: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD)
DC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤TA ≤+150°C for High Temperature
Parameter
No.
Typical
Max
Units
Conditions
Power-Down Current (IPD)
HDC60e
250
HDC61c
3
2000
5
μA
+150°C
3.3V Base Power-Down Current^(1,3)
μA
+150°C
3.3V Watchdog Timer Current: ΔIWDT^(2,4)
Note 1: Base IPD is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and
pulled to VSS. WDT, etc., are all switched off, and VREGS (RCON<8>) = 1.
2: The Δ current is the additional current consumed when the module is enabled. This current should be
added to the base IPD current.
3: These currents are measured on the device containing the most memory in this family.
4: These parameters are characterized, but are not tested in manufacturing.
TABLE 29-5: DC CHARACTERISTICS: DOZE CURRENT (IDOZE)
DC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤TA ≤+150°C for High Temperature
Parameter
No.
Typical⁽¹⁾
Max
Doze
Ratio
Units
Conditions
HDC72a
39
45
1:2
mA
HDC72f
18
25
1:64
mA +150°C
3.3V
20 MIPS
HDC72g
18
25
1:128
mA
Note 1: Parameters with Doze ratios of 1:2 and 1:64 are characterized, but are not tested in manufacturing.
© 2007-2012 Microchip Technology Inc.
DS70293G-page 347