PIC16LF1507 Datasheet, PDF (230/266 Pages) Microchip Technology – 20-Pin Flash, 8-Bit Microcontrollers

PIC16(L)F1507
25.6 Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C  TA  +125°C
Param
No.
Sym.
Characteristic
Typ.
Units
Conditions
TH01
JA Thermal Resistance Junction to Ambient TBD
C/W 20-pin PDIP package
TBD
C/W 20-pin SOIC package
89.3
C/W 20-pin SSOP package
TBD
C/W 20-pin QFN 4X4mm package
TH02
JC Thermal Resistance Junction to Case
TBD
C/W _{20-pin PDIP package}
TBD
C/W 20-pin SOIC package
31.1
C/W 20-pin SSOP package
TBD
C/W 20-pin QFN 4X4mm package
TH03
TJMAX Maximum Junction Temperature
150
C
TH04
PD Power Dissipation
—
W
PD = PINTERNAL + PI/O
TH05 PINTERNAL Internal Power Dissipation
—
W
PINTERNAL = IDD x VDD⁽¹⁾
TH06
PI/O I/O Power Dissipation
—
W
PI/O =  (IOL * VOL) +  (IOH * (VDD - VOH))
TH07
PDER Derated Power
—
W
PDER = PDMAX (TJ - TA)/JA⁽²⁾
Legend: TBD = To Be Determined
Note 1: IDD is current to run the chip alone without driving any load on the output pins.
2: TA = Ambient Temperature
3: TJ = Junction Temperature
 2011 Microchip Technology Inc.
Preliminary
DS41586A-page 230