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| PIC16F722AT-ISS Datasheet, PDF (208/286 Pages) Microchip Technology – 28-Pin Flash Microcontrollers with nanoWatt XLP Technology | |||
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PIC16(L)F722A/723A
23.5 Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ï£ TA ï£ +125°C
Param
No.
Sym.
Characteristic
Typ.
Units
Conditions
TH01
ï±JA Thermal Resistance Junction to Ambient 60.0
ï°C/W 28-pin SPDIP package
69.7
ï°C/W 28-pin SOIC package
71.0
ï°C/W 28-pin SSOP package
52.5
ï°C/W 28-pin UQFN 4x4mm package
30.0
ï°C/W 28-pin QFN 6x6mm package
TH02
ï±JC Thermal Resistance Junction to Case
29.0
ï°C/W 28-pin SPDIP package
18.9
ï°C/W 28-pin SOIC package
24.0
ï°C/W 28-pin SSOP package
16.7
ï°C/W 28-pin UQFN 4x4mm package
5.0
ï°C/W 28-pin QFN 6x6mm package
TH03
TJMAX Maximum Junction Temperature
150
ï°C
TH04
TH05
PD Power Dissipation
PINTERNAL Internal Power Dissipation
â
W
PD = PINTERNAL + PI/O
â
W
PINTERNAL = IDD x VDD(1)
TH06
TH07
PI/O
PDER
I/O Power Dissipation
Derated Power
â
W
PI/O = ï (IOL * VOL) + ï (IOH * (VDD - VOH))
â
W
PDER = PDMAX (TJ - TA)/ï±JA(2)
Note 1: IDD is current to run the chip alone without driving any load on the output pins.
2: TA = Ambient Temperature
3: TJ = Junction Temperature
DS41417B-page 208
ï£ 2010-2012 Microchip Technology Inc.
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