PIC16F684T-E Datasheet, PDF (178/192 Pages) Microchip Technology – 14-Pin, Flash-Based 8-Bit CMOS Microcontrollers with nanoWatt Technology

PIC16F684
14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
E
E1
NOTE 1
12
e
b
c
φ
A
A2
A1
L1
L
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Units
Dimension Limits
N
e
A
A2
MILLIMETERS
MIN
NOM
MAX
14
0.65 BSC
–
–
1.20
0.80
1.00
1.05
Standoff
Overall Width
Molded Package Width
A1
0.05
–
0.15
E
6.40 BSC
E1
4.30
4.40
4.50
Molded Package Length
D
4.90
5.00
5.10
Foot Length
L
0.45
0.60
0.75
Footprint
L1
1.00 REF
Foot Angle
φ
0°
–
8°
Lead Thickness
c
0.09
–
0.20
Notes:
Lead Width
b
0.19
–
0.30
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-087B
DS41202F-page 176
© 2007 Microchip Technology Inc.