PIC16F684T-E Datasheet, PDF (139/192 Pages) Microchip Technology – 14-Pin, Flash-Based 8-Bit CMOS Microcontrollers with nanoWatt Technology

PIC16F684
15.6 Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +125°C
Param
No.
TH01
TH02
TH03
TH04
TH05
TH06
TH07
Note 1:
2:
3:
Sym
Characteristic
Typ
Units
Conditions
θJA
Thermal Resistance
Junction to Ambient
69.8
C/W 14-pin PDIP package
85.0
C/W 14-pin SOIC package
100.4
C/W 14-pin TSSOP package
46.3
C/W 16-pin QFN 4x0.9mm package
θJC
Thermal Resistance
Junction to Case
32.5
C/W 14-pin PDIP package
31.0
C/W 14-pin SOIC package
31.7
C/W 14-pin TSSOP package
2.6
C/W 16-pin QFN 4x0.9mm package
TJ
Junction Temperature
150
C For derated power calculations
PD
Power Dissipation
—
W PD = PINTERNAL + PI/O
PINTERNAL Internal Power Dissipation
—
W PINTERNAL = IDD x VDD
(NOTE 1)
PI/O
I/O Power Dissipation
—
W PI/O = Σ (IOL * VOL) + Σ (IOH * (VDD - VOH))
PDER
Derated Power
—
W PDER = (TJ - TA)/θJA
(NOTE 2, 3)
IDD is current to run the chip alone without driving any load on the output pins.
TA = Ambient Temperature.
Maximum allowable power dissipation is the lower value of either the absolute maximum total power
dissipation or derated power (PDER).
© 2007 Microchip Technology Inc.
DS41202F-page 137