PIC16F877-20L Datasheet, PDF (153/218 Pages) Microchip Technology – 28/40-Pin 8-Bit CMOS FLASH Microcontrollers

PIC16F87X
15.1 DC Characteristics: PIC16F873/874/876/877-04 (Commercial, Industrial)
PIC16F873/874/876/877-20 (Commercial, Industrial)
PIC16LF873/874/876/877-04 (Commercial, Industrial)
(Continued)
PIC16LF873/ 874/ 876/ 877-04
(Commercial, Industrial)
PIC16F873/ 874/ 876/ 877-04
PIC16F873/ 874/ 876/ 877-20
(Commercial, Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C  TA  +85°C for industrial
0°C  TA  +70°C for commercial
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C  TA  +85°C for industrial
0°C  TA  +70°C for commercial
Param Symbol
No.
Characteristic/
Device
Min Typ† Max Units
Conditions
IDD Supply Current^(2,5)
D010
16LF87X —
0.6 2.0 mA XT, RC osc configuration
FOSC = 4 MHz, VDD = 3.0V
D010
16F87X — 1.6 4 mA RC osc configurations
FOSC = 4 MHz, VDD = 5.5V
D010A
16LF87X — 20 35 A LP osc configuration
FOSC = 32 kHz, VDD = 3.0V,
WDT disabled
D013
16F87X —
7
15 mA HS osc configuration,
FOSC = 20 MHz, VDD = 5.5V
D015
IBOR Brown-out
Reset Current⁽⁶⁾
— 85 200 A BOR enabled, VDD = 5.0V
Legend: Rows with standard voltage device data only are shaded for improved readability.
† Data in “Typ” column is at 5V, 25°C, unless otherwise stated. These parameters are for design guidance
only, and are not tested.
Note 1: This is the limit to which VDD can be lowered without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
loading, switching rate, oscillator type, internal code execution pattern and temperature also have an impact
on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tri-stated, pulled to VDD;
MCLR = VDD; WDT enabled/disabled as specified.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
4: For RC osc configuration, current through REXT is not included. The current through the resistor can be esti-
mated by the formula Ir = VDD/2REXT (mA) with REXT in kOhm.
5: Timer1 oscillator (when enabled) adds approximately 20 A to the specification. This value is from charac-
terization and is for design guidance only. This is not tested.
6: The  current is the additional current consumed when this peripheral is enabled. This current should be
added to the base IDD or IPD measurement.
7: When BOR is enabled, the device will operate correctly until the VBOR voltage trip point is reached.
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DS30292D-page 153