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| PIC16F877-20L Datasheet, PDF (149/218 Pages) Microchip Technology – 28/40-Pin 8-Bit CMOS FLASH Microcontrollers | |||
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PIC16F87X
15.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings â
Ambient temperature under bias................................................................................................................ .-55 to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on any pin with respect to VSS (except VDD, MCLR. and RA4) ....................................... -0.3 V to (VDD + 0.3 V)
Voltage on VDD with respect to VSS ........................................................................................................... -0.3 to +7.5 V
Voltage on MCLR with respect to VSS (Note 2) ................................................................................................0 to +14 V
Voltage on RA4 with respect to Vss .................................................................................................................0 to +8.5 V
Total power dissipation (Note 1) ..............................................................................................................................1.0 W
Maximum current out of VSS pin ...........................................................................................................................300 mA
Maximum current into VDD pin ..............................................................................................................................250 mA
Input clamp current, IIK (VI < 0 or VI > VDD)ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï® ï±ï 20 mA
Output clamp current, IOK (VO < 0 or VO > VDD) ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï® ï±ï 20 mA
Maximum output current sunk by any I/O pin..........................................................................................................25 mA
Maximum output current sourced by any I/O pin ....................................................................................................25 mA
Maximum current sunk byï PORTA, PORTB, and PORTE (combined) (Note 3) ...................................................200 mA
Maximum current sourced by PORTA, PORTB, and PORTE (combined) (Note 3)..............................................200 mA
Maximum current sunk by PORTC and PORTD (combined) (Note 3) .................................................................200 mA
Maximum current sourced by PORTC and PORTD (combined) (Note 3) ............................................................200 mA
Note 1: Power dissipation is calculated as follows: Pdis = VDD x {IDD - ï¥ IOH} + ï¥ {(VDD - VOH) x IOH} + ï¥(VOl x IOL)
2: Voltage spikes below VSS at the MCLR pin, inducing currents greater than 80 mA, may cause latch-up.
Thus, a series resistor of 50-100ï should be used when applying a âlowâ level to the MCLR pin, rather than
pulling this pin directly to VSS.
3: PORTD and PORTE are not implemented on PIC16F873/876 devices.
â NOTICE: Stresses above those listed under âAbsolute Maximum Ratingsâ may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
ï£ 1998-2013 Microchip Technology Inc.
DS30292D-page 149
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