MLX90364 Datasheet, PDF (4/36 Pages) Melexis Microelectronic Systems – Triaxis® Position Sensor Assembly

MLX90364
Triaxis® Position Sensor Assembly
2. Description
The MLX90364 Triaxis® Position Sensor Assembly is a high accuracy linear and angular position sensor which
eliminates need for inclusion of a printed circuit board (PCB) within sensing modules.
This device is based on a Dual Mold Package (DMP) construction, which integrates a Triaxis position sensing die
together with the decoupling capacitors necessary to meet the strenuous ESD and EMC requirements. No PCB is
needed.
The Triaxis position sensing die is nothing but the one used for the MLX90365 in conventional surface-mount
packages (SOIC-8 – single die & TSSOP-16 – dual die).
The decoupling capacitors are X8R type and well suited for package integration and the target
operating temperature range.
Similarly to other Triaxis products, the MLX90364 is sensitive to the flux density applied orthogonally and parallel
to the IC surface i.e. the 3 components of the flux density applied to the IC (i.e. BX, BY and BZ).
This allows the MLX90364 with the correct magnetic circuit to decode the absolute position of any moving magnet
(e.g. rotary position from 0 to 360 Degrees or linear displacement, stroke).
MLX90364 reports a programmable ratiometric analog output signal compatible with any resistive potentiometer or
programmable linear Hall sensor. Through programming, the MLX90364 provides also a digital PWM (Pulse Width
Modulation) output characteristic.
MLX90364 Triaxis® Position Sensor Assembly enables the realization of position sensor modules for which a PCB
is no longer needed: this yield to an increase of the electrical, mechanical and environmental robustness of the final
application.
Figure 2 NoPCB – MLX90364 makes conventional PCB redundant
MLX90364
Rev 4.1
Page 4 of 36
Datasheet
19/11/2015