MLX90363 Datasheet, PDF (4/57 Pages) Melexis Microelectronic Systems – Triaxis® Magnetometer IC With High Speed Serial Interface

MLX90363
Triaxis® Magnetometer IC
With High Speed Serial Interface
17. MLX90363 DESCRIPTION OF END-USER PROGRAMMABLE ITEMS ........................................... 39
17.1. USER CONFIGURATION: DEVICE ORIENTATION.........................................................................................39
17.2. USER CONFIGURATION: MAGNETIC ANGLE FORMULA .............................................................................39
17.3. USER CONFIGURATION: 3D=0 FORMULA TRIMMING PARAMETERS SMISM AND ORTH_B1B2 ...............39
17.3.1. Magnetic Angle ∠XY............................................................................................................................39
17.3.2. Magnetic Angle ∠XZ and ∠YZ ............................................................................................................40
17.4. USER CONFIGURATION: 3D=1 FORMULA TRIMMING PARAMETERS KALPHA, KBETA, KT ....................40
17.5. USER CONFIGURATION: FILTER ................................................................................................................41
17.6. VIRTUAL GAIN MIN AND MAX PARAMETERS ...........................................................................................41
17.7. HYSTERESIS FILTER ................................................................................................................................42
17.8. EMC FILTER ON SCI PINS.........................................................................................................................42
17.9. IDENTIFICATION & FREE BYTES...............................................................................................................42
17.10. LOCK.........................................................................................................................................................42
18. MLX90363 SELF DIAGNOSTIC.......................................................................................................... 43
19. MLX90363 FIRMWARE FLOWCHARTS ............................................................................................ 44
19.1.
19.2.
19.3.
19.4.
START-UP SEQUENCE ................................................................................................................................44
SIGNAL PROCESSING (GETX) ...................................................................................................................45
FAIL-SAFE MODE ......................................................................................................................................45
AUTOMATIC GAIN CONTROL ....................................................................................................................46
20. RECOMMENDED APPLICATION DIAGRAMS .................................................................................. 47
20.1.
20.2.
20.3.
20.4.
MLX90363 IN SOIC-8 PACKAGE AND 5V APPLICATION DIAGRAMS........................................................47
MLX90363 IN SOIC-8 PACKAGE AND 3V3 APPLICATION DIAGRAMS......................................................47
MLX90363 IN TSSOP-16 PACKAGE AND 5V APPLICATION DIAGRAMS...................................................48
MLX90363 IN TSSOP-16 PACKAGE AND 3V3 APPLICATION DIAGRAMS.................................................49
21. STANDARD INFORMATION REGARDING MANUFACTURABILITY OF MELEXIS PRODUCTS
WITH DIFFERENT SOLDERING PROCESSES ........................................................................................ 50
22. ESD PRECAUTIONS........................................................................................................................... 50
23. PACKAGE INFORMATION................................................................................................................. 51
23.1.
23.2.
23.3.
23.4.
23.5.
23.6.
SOIC8 – PACKAGE DIMENSIONS...............................................................................................................51
SOIC8 – PINOUT AND MARKING...............................................................................................................52
SOIC8 – IMC POSITIONNING ....................................................................................................................53
TSSOP16 – PACKAGE DIMENSIONS..........................................................................................................54
TSSOP16 – PINOUT AND MARKING..........................................................................................................55
TSSOP16 – IMC POSITIONNING ...............................................................................................................55
24. DISCLAIMER ....................................................................................................................................... 57
3901090363
Rev. 005
Page 4 of 57
Data Sheet
Jul/13