MAX14826 Datasheet, PDF (3/32 Pages) Maxim Integrated Products – IO-Link Device Transceiver

MAX14826
IO-Link Device Transceiver
Absolute Maximum Ratings
(All voltages referenced to GND, unless otherwise noted.)
V_CC..........................................................................-40V to +40V
V_P (I_VP < 50mA)...... the higher of -0.3V and (V_CC - 1V) to +40V
LDOIN....................................................................-0.3V to +40V
V₅..................... -0.3V to the lesser of (V_LDOIN + 0.3V) and +6V
LDO33...................... -0.3V to the lesser of (V₅ + 0.3V) and +6V
V_L.............................................................................-0.3V to +6V
DI ............................................................................-40V to +40V
C/Q, DO....................... MIN: the higher of -40V and (V_CC - 40V)
MAX: the lesser of +40V and (V_CC + 40V)
Logic Inputs
TX, TXEN, LO, CS/PNP, SDI/DOPP,
SCLK/CQPP............................................. -0.3V to (V_L + 0.3V)
Logic Outputs
RX, WU/THSD, LI, SDO/DOOC,
IRQ/CQOC............................................... -0.3V to (V_L + 0.3V)
UV.........................................................................-0.3V to +6V
Continuous Current Into Any Logic Pin............................ Q50mA
Continuous Power Dissipation
TQFN (derate 27.8mW/°C above +70°C)..................2222mW
Operating Temperature Range.......................... -40°C to +105°C
Maximum Junction Temperature......................................+150°C
Storage Temperature Range............................. -65°C to +150°C
Lead Temperature (soldering, 10s).................................. +300°C
Soldering Temperature (reflow)........................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics (Note 1)
TQFN
Junction-to-Ambient Thermal Resistance (θ_JA)...........36°C/W
Junction-to-Case Thermal Resistance (θ_JC)..................3°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
DC Electrical Characteristics
(V_CC = 18V to 36V, V_L = 2.3V to 5.5V, V_GND = 0V; all logic inputs at V_L or GND; T_A = -40°C to +105°C, unless otherwise noted.
Typical values are at V_CC = 24V, V_L = 3.3V, and T_A = +25°C, unless otherwise noted.) (Note 2)
PARAMETER
V_CC Supply Voltage
V_CC Supply Current
V_CC Undervoltage Lockout
Threshold
V_CC Undervoltage Lockout
Threshold Hysteresis
SYMBOL
CONDITIONS
MIN
V_CC
For driver operation
9
V_CC = 24V, C/Q as input, no load on V₅
I_CC
or LDO33, LDOIN not connected to V_P,
V_LDOIN = 24V
V_CCUVLO V_CC falling
6
V_{CCUVLO_HYST}
TYP
1.2
7.4
200
MAX UNITS
36
V
2.5
mA
8.4
V
mV
V₅ Supply Current
V₅ Undervoltage Lockout
Threshold
V_L Logic-Level Supply Voltage
V_L Logic-Level Supply Current
V_L Undervoltage Threshold
I_{5_IN}
V_5UVLO
V_L
I_L
V_LUVLO
LDOIN shorted to V₅, external 5V
applied to V₅, no switching, LDO33
disabled
V₅ falling
All logic inputs at V_L
All logic inputs at GND
V_L falling
3
mA
2.4
V
2.3
5.5
V
5
µA
100
µA
0.65 0.95 1.30
V
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