LTC3335_15 Datasheet, PDF (27/28 Pages) Linear Technology – Nanopower Buck-Boost DC/DC with Integrated Coulomb Counter

Package Description
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
UDC Package
20-Lead Plastic QFN (3mm × 4mm)
(Reference LTC DWG # 05-08-1742 Rev Ø)
LTC3335
3.50 ±0.05
2.10 ±0.05
1.50 REF
2.65 ±0.05
1.65 ±0.05
0.70 ±0.05
PACKAGE OUTLINE
0.25 ±0.05
0.50 BSC
2.50 REF
3.10 ±0.05
4.50 ±0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
3.00 ±0.10
0.75 ±0.05
R = 0.05 TYP
4.00 ±0.10
PIN 1
TOP MARK
(NOTE 6)
2.50 REF
1.50 REF
19 20
2.65 ±0.10
1.65 ±0.10
PIN 1 NOTCH
R = 0.20 OR 0.25
× 45° CHAMFER
0.40 ±0.10
1
2
0.200 REF
0.00 – 0.05
(UDC20) QFN 1106 REV Ø
R = 0.115
TYP
0.25 ±0.05
0.50 BSC
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
LINEAR TECHNOLOGY CONFIDENTIAL ^{However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-}
tion that the interconneFcotiornmoof irtseciinrcfouirtms aastdioenscwribwedwh.leinreeinarw.cilol nmot/LinTfCrin3g3e3o5n existing patent rights.
3335p
27