ISL12020MIRZ-T7A Datasheet, PDF (6/34 Pages) Intersil Corporation – Low Power RTC with Battery Backed SRAM, Integrated ±5ppm Temperature Compensation and Auto Daylight Saving

ISL12020M
Absolute Maximum Ratings
Voltage on V_DD, V_BAT and IRQ/F_OUT pins
(Respect to Ground) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6.0V
Voltage on SCL and SDA pins
(Respect to Ground) . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to V_DD + 0.3V
Voltage on X1 and X2 pins
(Respect to Ground, Note 6) . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 2.5V
ESD Rating
Human Body Model
(Per MIL-STD-883 Method 3014) . . . . . . . . . . . . . . . . . . . . . . . . . . >3kV
Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >300V
Latch Up (Tested per JESD-78B; Class 2, Level A) . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100mA or 1.5 * V_MAX Input
Shock Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . 5000g, 0.3ms, 1/2 sine
Vibration (Ultrasound cleaning not advised) . . . . . . . . . . . 20g/10-2000Hz,
Thermal Information
Thermal Resistance (Typical)
_JA (°C/W)
_JC (°C/W)
20 Lead DFN (Notes 4, 5) . . . . . . . . . . . . . . 40
3.5
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +85°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
Pb-Free Reflow Profile (Note 7). . . . . . . . . . . . . . . . . . . . . . . . see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
4. _JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
Brief TB379.
5. For _JC, the “case temp” location is the center of the exposed metal pad on the package underside.
6. The X1 and X2 pins are connected internally to a crystal and should be a floating electrical connection.
7. The ISL12020M Oscillator Initial Accuracy can change after solder reflow attachment. The amount of change will depend on the reflow temperature
and length of exposure. A general rule is to use only one reflow cycle and keep the temperature and time as short as possible. Changes on the order
of ±1ppm to ±3ppm can be expected with typical reflow profiles.
DC Operating Characteristics - RTC Test Conditions: VDD = +2.7 to +5.5V, T_A = -40°C to +85°C, unless otherwise stated. Boldface
limits apply over the operating temperature range, -40°C to +85°C.
SYMBOL
PARAMETER
CONDITIONS
MIN
(Note 8)
TYP
(Note 9)
MAX
(Note 8)
UNITS NOTES
V_DD
V_BAT
I_DD1
I_DD2
I_DD3
Main Power Supply
(Note 10)
Battery Supply Voltage
(Note 10)
Supply Current. (I²C not active,
temperature conversion not active, F_OUT
not active)
V_DD = 5V
V_DD = 3V
Supply Current. (I²C Active, Temperature
Conversion not Active, F_OUT not Active)
Supply Current. (I²C not Active,
Temperature Conversion Active, F_OUT not
Active)
V_DD = 5V
V_DD = 5V
2.7
5.5
V
1.8
5.5
V
11
4.1
15
µA
12, 13
3.5
14
µA
12, 13
200
500
µA
12, 13
120
400
µA
12, 13
I_BAT Battery Supply Current
I_BATLKG Battery Input Leakage
I_LI
Input Leakage Current on SCL
I_LO I/O Leakage Current on SDA
V_BATM Battery Level Monitor Threshold
V_PBM Brownout Level Monitor Threshold
V_TRIP V_BAT Mode Threshold
V_TRIPHYS V_TRIP Hysteresis
V_BATHYS V_BAT Hysteresis
Fout_25°C Oscillator Initial Accuracy
Fout_T Oscillator Stability vs Temperature
V_DD = 0V, V_BAT = 3V, T_A =+25°C
V_DD = 0V, V_BAT = 3V
V_DD = 5.5V, V_BAT = 1.8V
V_IL = 0V, V_IH = V_DD
V_IL = 0V, V_IH = V_DD
(Note 10)
-1.0
-1.0
-100
-100
2.0
V_DD = 3.3V, T_A = +25°C
V_DD = 3.3V
-5
1.0
1.0
±0.1
±0.1
2.2
30
50
±2
1.6
5.0
100
1.0
1.0
+100
+100
2.4
+5
µA
12
µA
12
nA
µA
µA
mV
mV
V
mV
15
mV
15
ppm
7, 15
ppm
7, 15
6
FN6667.5
December 13, 2011