ISL28025 Datasheet, PDF (47/47 Pages) Intersil Corporation – Precision Digital Power Monitor with Real Time Alerts

ISL28025
Package Outline Drawing
W4x4.16C
(WLCSP 0.5mm PITCH) WAFER LEVEL CHIP SCALE PACKAGE
Rev 1, 05/14
X
Y
2.160 ±0.030
1.500
0.500
2.160 ±0.030
(4X) 0.10
TOP VIEW
PIN 1
(A1 CORNER)
D
C
16x 0.320 ±0.030
B
A
1
2
0.250
3
4
0.330
BOTTOM VIEW
0.330
0.280
0.500
PACKAGE
OUTLINE
0.330
3 NSMD
RECOMMENDED LAND PATTERN
0.05 Z
SEATING PLANE
0.320 ±0.030
Ø0.10 M Z X Y
Ø0.05 M Z
0.600 ±0.06mm
0.240 ±0.030
SIDE VIEW
NOTES:
1. All dimensions are in millimeters.
2. Dimension and tolerance per ASMEY 14.5M-1994,
and JESD 95-1 SPP-010.
3. NSMD refers to non-solder mask defined pad design per Intersil Techbrief TB451.
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FN8388.3
June 17, 2015