ISL33001_14 Datasheet, PDF (4/18 Pages) Intersil Corporation – I2C Bus Buffer with Rise Time Accelerators and Hot Swap Capability

ISL33001, ISL33002, ISL33003
Absolute Maximum Ratings
(All voltages referenced to GND)
V_CC1, V_CC2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +7V
SDA_IN, SCL_IN, SDA_OUT, SCL_OUT, READY. . . . . . . . . . . . . -0.3V to +7V
EN, ACC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +(V_CC1 + 0.3)V
Maximum Sink Current (SDA and SCL Pins) . . . . . . . . . . . . . . . . . . . . 20mA
Maximum Sink Current (READY pin) . . . . . . . . . . . . . . . . . . . . . . . . . . . 7mA
Latch-Up Tested per JESD78, Level 2, Class A . . . . . . . . . . . . . . . . . . 85°C
ESD Ratings. . . . . . . . . . . . . . . . . . . . . . See “ESD PROTECTION” on page 5
Operating Conditions
Temperature Range, T_A . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
V_CC1 and V_CC2 Supply Voltage Range . . . . . . . . . . . . . . . . . +2.3V to +5.5V
Thermal Information
Thermal Resistance
_JA (°C/W) _JC (°C/W)
8 Ld TDFN Package (Notes 5, 6) . . . . . . . . . .
47
4
(0.50mm Pitch)
8 Ld TDFN Package (Notes 5, 6) . . . . . . . . . .
48
6
(0.65mm Pitch)
8 Ld MSOP Package (Notes 4, 7) . . . . . . . . . 151
50
8 Ld SOIC Package (Notes 4, 7) . . . . . . . . . . 120
56
Maximum Storage Temperature Range . . . . . . . . . . . . . -65°C to +150°C
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see TB493
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
4. _JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
5. _JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
Brief TB379.
6. For _JC, the “case temp” location is the center of the exposed metal pad on the package underside.
7. For _JC, the “case temp” location is taken at the package top center.
Electrical Specifications V_EN = V_CC1, V_CC1 = +2.3V to +5.5V, V_CC2 = +2.3V to +5.5V, unless otherwise noted (Note 8). Boldface limits apply
over the operating temperature range, -40°C to +85°C.
PARAMETER
SYMBOL
CONDITIONS
TEMP
MIN
MAX
(°C) (Note 9)
TYP
(Note 9) UNITS
POWER SUPPLIES
V_CC1 Supply Range
V_CC1
Full
2.3
-
5.5
V
V_CC2 Supply Range
V_CC2
ISL33002 and ISL33003
Full
2.3
-
5.5
V
Supply Current from V_CC1
I_CC1
V_CC1 = 5.5V; ISL33001 only (Note 11)
Full
-
2.1
4.0
mA
V_CC1 = V_CC2 = 5.5V; ISL33002 and ISL33003
Full
-
(Note 11)
2.0
3.0
mA
Supply Current from V_CC2
I_CC2
V_CC2 = V_CC1 = 5.5V; ISL33002 and ISL33003
Full
-
(Note 11)
0.22
0.6
mA
V_CC1 Shut-down Supply
I_SHDN1 V_CC1 = 5.5V, V_EN = GND; ISL33001 only
Full
-
Current
V_CC1 = V_CC2 = 5.5V, V_EN = GND; ISL33003 only Full
-
(Note 13)
0.5
0.05
-
µA
-
µA
V_CC2 Shut-down Supply
I_SHDN2 V_CC1 = V_CC2 = 5.5V, V_EN = GND, ISL33003 only Full
-
Current
(Note 13)
0.06
-
µA
START-UP CIRCUITRY
Precharge Circuitry
Voltage
V_PRE
SDA and SCL pins floating
Full
0.8
1
1.2
V
Enable High Threshold
Voltage
V_{EN_H}
+25
-
0.5*V_CC 0.7*V_CC
V
Enable Low Threshold
Voltage
V_{EN_L}
+25 0.3*V_CC 0.5*V_CC
-
V
Enable Pin Input Current
I_EN
Enable from 0V to V_CC1; ISL33001 and
ISL33003
Full
-1
0.1
1
µA
Enable Delay, On-Off
Enable Delay, Off-On
Bus Idle Time
Ready Pin OFF State
Leakage Current
t_EN-HL
t_EN-LH
t_IDLE
I_OFF
ISL33001 and ISL33003 (Note 10)
ISL33001 and ISL33003 (Figure 3)
(Figure 4, Note 12)
ISL33001 only
+25
-
+25
-
Full
50
+25
-1
10
-
ns
86
-
µs
83
150
µs
0.1
1
µA
Ready Delay, On-Off
t_READY-HL ISL33001 only (Note 10)
+25
-
10
-
ns
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FN7560.6
July 11, 2014