ISL33001_14 Datasheet, PDF (15/18 Pages) Intersil Corporation – I2C Bus Buffer with Rise Time Accelerators and Hot Swap Capability

ISL33001, ISL33002, ISL33003
Package Outline Drawing
L8.3x3H
8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE (TDFN)
Rev 0, 2/08
2.38
3.00
6
PIN 1
INDEX AREA
A
B
PIN #1 INDEX AREA
6
1.50 REF
6 X 0.50
1
4
8 X 0.40
2.20
3.00
1.64
(4X) 0.15
TOP VIEW
( 2.38 )
2 . 80 ( 2 .20 )
( 1.64 )
8X 0.60
( 6X 0 . 5 )
( 8X 0.25 )
TYPICAL RECOMMENDED LAND PATTERN
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0 .80 MAX
8
BOTTOM VIEW
5
0.10 M C A B
8 X 0.25
SIDE VIEW
SEE DETAIL "X"
0.10 C _C
BASE PLANE
SEATING PLANE
0.08 C
C
0.2 REF
0 . 00 MIN.
0 . 05 MAX.
DETAIL “X”
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3. Unless otherwise specified, tolerance : Decimal ± 0.05
4. Lead width dimension applies to the metallized terminal and is
measured between 0.15mm and 0.30mm from the terminal tip.
5. Tiebar shown (if present) is a non-functional feature.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
FN7560.6
July 11, 2014