ISL33001_14 Datasheet, PDF (17/18 Pages) Intersil Corporation – I2C Bus Buffer with Rise Time Accelerators and Hot Swap Capability

ISL33001, ISL33002, ISL33003
Package Outline Drawing
M8.118
8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
Rev 4, 7/11
5
3.0±0.05
A
8
D
1.10 MAX
3.0±0.05 ^4.9±0.15
5
SIDE VIEW 2
DETAIL "X"
0.09 - 0.20
PIN# 1 ID
12
B
0.65 BSC
TOP VIEW
0.95 REF
GAUGE
PLANE
0.25
H
0.25 - 0.36
0.08 M C A-B D
SIDE VIEW 1
0.85±010
C
SEATING PLANE
0.10 ± 0.05
0.10 C
0.55 ± 0.15
DETAIL "X"
3°±3°
(5.80)
(4.40)
(3.00)
(0.65)
(1.40)
(0.40)
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1. Dimensions are in millimeters.
2. Dimensioning and tolerancing conform to JEDEC MO-187-AA
and AMSEY14.5m-1994.
3. Plastic or metal protrusions of 0.15mm max per side are not
included.
4. Plastic interlead protrusions of 0.15mm max per side are not
included.
5. Dimensions are measured at Datum Plane "H".
6. Dimensions in ( ) are for reference only.
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FN7560.6
July 11, 2014