ISL33001_14 Datasheet, PDF (13/18 Pages) Intersil Corporation – I2C Bus Buffer with Rise Time Accelerators and Hot Swap Capability

ISL33001, ISL33002, ISL33003
Typical Performance Curves (Continued) C_IN = C_OUT = 10pF, V_CC1 = V_CC2 = V_CC, T_A = +25°C; Unless Otherwise
50
T = +85°C
40
R_PULL-UP = 2.7kΩ
C_IN = 10pF
C_OUT = 100pF
50
T = +85°C
40
T = +25°C
30
30
20
T = -40°C
10
0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
V_CC (V)
FIGURE 23. PROPAGATION DELAY H-L vs V_CC
T = +25°C
20
T = -40°C
10
V_CC = 3.3V
R_PULL-UP = 10kΩ
C_IN = 50pF
0
0 100 200 300 400 500 600 700 800 900
C_OUT (pF)
FIGURE 24. PROPAGATION DELAY H-L vs C_OUT
12
11
V_CC = 2.3V
V_CC = 3.3V
10
9
V_CC = 5.5V
Die Characteristics
SUBSTRATE AND TDFN THERMAL PAD POTENTIAL
(POWERED UP):
GND
PROCESS:
0.25µm CMOS
8
7
6
-30
-10
10
30
50
70
90
TEMPERATURE (°C)
FIGURE 25. SDA/SCL PIN CAPACITANCE vs TEMPERATURE vs V_CC
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FN7560.6
July 11, 2014