HC55120_06 Datasheet, PDF (4/36 Pages) Intersil Corporation – Low Power Universal SLIC Family

HC55120, HC55121, HC55130, HC55140, HC55142, HC55143, HC55150
Absolute Maximum Ratings T_A = 25°C
Temperature, Humidity
Storage Temperature Range . . . . . . . . . . . . . . . . .-65°C to 150°C
Operating Temperature Range. . . . . . . . . . . . . . . . -40°C to 110°C
Operating Junction Temperature Range . . . . . . . .-40°C to 150°C
Power Supply (-40°C ≤ T_A ≤ 85°C)
Supply Voltage V_CC to GND . . . . . . . . . . . . . . . . . . . . -0.4V to 7V
Supply Voltage V_BL to GND . . . . . . . . . . . . . . . . . . . .-V_BH to 0.4V
Supply Voltage V_BH to GND, Continuous . . . . . . . . . -75V to 0.4V
Supply Voltage V_BH to GND, 10ms . . . . . . . . . . . . . . -80V to 0.4V
Relay Driver
Ring Relay Supply Voltage . . . . . . . . . . . . . . . . . . . . . . 0V to 14V
Ring Relay Current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50mA
Digital Inputs, Outputs (C1, C2, C3, C4, C5, SHD, GKD_LVM)
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.4V to V_CC
Output Voltage (SHD, GKD_LVM Not Active) . . . . . -0.4V to V_CC
Output Current (SHD, GKD_LVM) . . . . . . . . . . . . . . . . . . . . . 5mA
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .500V
Gate Count. . . . . . . . . . . . . . . . . . . . . . . 543 Transistors, 51 Diodes
Tipx and Ringx Terminals (-40°C ≤ T_A ≤ 85°C)
Tipx or Ringx Current . . . . . . . . . . . . . . . . . . . . -100mA to 100mA
Thermal Information
Thermal Resistance (Typical, Note 1)
θ_JA
28 Lead PLCC Package. . . . . . . . . . . . . . . . . . . . . . 52°C/W
28 Lead SOIC Package . . . . . . . . . . . . . . . . . . . . . . 45°C/W
32 Lead PLCC Package. . . . . . . . . . . . . . . . . . . . . . 66.2°C/W
Continuous Power Dissipation at 85°C
28 Lead PLCC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.5W
28 Lead SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2.0W
32 Lead PLCC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.4W
Lead Temperature (Soldering 10s) . . . . . . . . . . . . . . . . . . . . . . . . 300°C
(PLCC, SOIC - Lead Tips Only)
Derate above 70°C
Tip and Ring Terminals
Tipx or Ringx, Current, Pulse < 10ms, T_REP > 10s . . . . . . . . . .2A
Tipx or Ringx, Current, Pulse < 1ms, T_REP > 10s . . . . . . . . . . .5A
Tipx or Ringx, Current, Pulse < 10µs, T_REP > 10s . . . . . . . . .15A
Tipx or Ringx, Current, Pulse < 1µs, T_REP > 10s . . . . . . . . . .20A
Tipx or Ringx, Pulse < 250ns, T_REP > 10s
20A
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θ_JA is measured with the component mounted on an evaluation PC board in free air.
Typical Operating Conditions
These represent the conditions under which the device was developed and are suggested as guidelines.
PARAMETER
CONDITIONS
MIN
TYP
MAX
Ambient Temperature
HC55120, HC55150/1
0
-
70
HC55121, HC55130/1, HC55140/1,
-40
-
85
HC55142/3
V_BH with Respect to GND
V_BL with Respect to GND
V_CC with Respect to GND
-58
-
-8
V_BH
-
0
4.75
-
5.25
UNITS
°C
°C
V
V
V
4
FN4659.13
June 1, 2006