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HC55120_06 Datasheet, PDF (20/36 Pages) Intersil Corporation – Low Power Universal SLIC Family
HC55120, HC55121, HC55130, HC55140, HC55142, HC55143, HC55150
SPM Pin
For optimum performance, the PC board interconnect the
SPM pin should be as short as possible. If pulses metering is
not being used, then this pin should be grounded as close to
the device pin as possible.
RLIM Pin
The current limiting resistor RLIM needs to be as close to the
RLIM pin as possible.
Layout of the 2-Wire Impedance Matching
Resistor ZT
Proper connection to the ZT pin is to have the external ZT
network as close to the device pin as possible.
The ZT pin is a high impedance pin that is used to set the
proper feedback for matching the impedance of the 2-wire
side. This will eliminate circuit board capacitance on this pin
to maintain the 2-wire return loss across frequency.
TABLE 1. DETECTOR STATES
STATE C3
C2
C1
SLIC OPERATING STATE
ACTIVE DETECTOR
0
0
0
0 Open Circuit State
4 wire loopback test capability
1
0
0
1 Ringing State
Ring Trip Detector
(Previous State cannot be Reverse
Active State)
2
0
1
0 Forward Active State
Loop Current Detector
OUTPUT
SHD GKD_ LVM
HIGH
HIGH
HIGH
Ground Key Detector
3
0
1
1 Test Active State
On Hook Loopback Detector
Requires previous state to be in the Ground Key Detector
Forward Active state to determine the
On hook or Off hook status of the line. Off Hook Loop Current Detector
Line Voltage Detector
4
1
0
0 Tip Open - Ground Start State
Ground Key Detector
LOW
LOW
HIGH
5
1
0
1 Reserved
6
1
1
0 Reverse Active State
Reserved
Loop Current Detector
N/A
N/A
Ground Key Detector
7
1
1
1 Test Reversal Active State
On Hook Loop Current Detector
Requires previous state to be in the
Reverse Active state to determine the Off Hook Loop Current Detector
On hook or Off hook status of the line. Line Voltage Detector
8
X
X
X Thermal Shutdown
LOW
LOW
HIGH
LOW
Digital Logic Inputs
Table 1 is the logic truth table for the 3V to 5V logic input
pins. A combination of the control pins C3, C2 and C1 select
1 of the possible 6 operating states. The 8th state listed is
Thermal Shutdown. Thermal Shutdown protection is invoked
if a fault condition on the tip or ring causes the junction
temperature of the die to exceed 175°C. A description of
each operating state and the control logic follows:
Open Circuit State (C3 = 0, C2 = 0, C1 = 0)
In this state, the tip and ring outputs are in a high impedance
condition (>1MΩ). No supervisory functions are available
and SHD and GKD outputs are at a TTL high level.
4-wire loopback testing can be performed in this state. With
the PTG pin floating, the signal on the VTX output is 180o out
of phase and approximately 2 times the VRX input signal. If
the PTG pin is grounded, then the amplitude will be
approximately the same as its input and 180o out of phase.
Ringing State (C3 = 0, C2 = 0, C1 = 1)
In this state, the output of the ring relay driver pin (RRLY)
goes low (energizing the ring relay to connect the ringing
signal to the phone) if either of the following two conditions
are satisfied:
(1) The RSYNC_REV pin is grounded through a resistor -
This connection enables the RRLY pin to go low the instant
the ringing state is invoked, without any regard for the
ringing voltage (90VRMS -120VRMS) across the relay
contacts. The resistor (34.8kΩ to 70kΩ) is required to limit
the current into the RSYNC_REV pin.
(2) A ring sync pulse is applied to the RSYNC_REV pin -
This connection enables the RRLY pin to go low at the
command of a ring sync pulse. A ring sync pulse should go
20
FN4659.13
June 1, 2006