ISL71841SEH Datasheet, PDF (25/29 Pages) Intersil Corporation – Radiation Hardened 30V 32-Channel Analog

ISL71841SEH
Die Characteristics
Die Dimensions
5000µm x 4080µm (197 mils x 161 mils)
Thickness: 483µm ±25µm (19 mils ±1 mil)
Interface Materials
GLASSIVATION
Type: 12kÅ Silicon Nitride on 3kÅ Oxide
TOP METALLIZATION
Type: 300Å TiN on 2.8µm AlCu
In Bondpads, TiN has been removed.
BACKSIDE FINISH
Silicon
PROCESS
P6SOI
Metalization Mask Layout
Assembly Related Information
SUBSTRATE POTENTIAL
Floating
Additional Information
WORST CASE CURRENT DENSITY
1.6 x 10⁵ A/cm²
TRANSISTOR COUNT
10752
Weight of Packaged Device
48 Ld CQFP: 1.54 grams (typical)
44 Ld CLCC: 2.02 grams (typical)
Lid Characteristics
Finish: Gold
Potential: Grounded, tied to package GND pin
In 48 Ld CQFP: pin 29
In 44 Ld CLCC: pin 26
IN12 IN13
IN14
IN15
IN16
OUT
IN32
IN31
IN30
IN29
IN28
IN11
IN27
IN10
IN26
IN9
IN25
IN8
IN24
IN7
IN23
IN6
IN22
IN5
IN21
IN4
IN20
IN3
IN19
IN2
IN1
V+
VREF
A0
A1
A2
A3
A4
IN18
EN
BAR
GND
V‐
IN17
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FN8735.4
June 3, 2016