TLE8262E Datasheet, PDF (91/93 Pages) Infineon Technologies AG – Universal System Basis Chip HERMES Rev. 1.0

TLE8262E
17
Package Outline
Package Outline
0.35 x 45˚
7.6 _-0.2 ¹⁾
0.65
C
17 x 0.65 = 11.05
0.1 C 36x
SEATING PLANE
0.33 ±0.08 ²⁾
36
0.17 M A-B C D 36x
A
19 _{Ejector Mark}
Cavity ID
0.7 ±0.2
10.3 ±0.3
D
Bottom View
19
36
Exposed Diepad
1
18
B
12.8
1)
-0.2
Index Marking
Ejector Mark
Polish Finish
Exposed Diepad Dimensions ⁴⁾
Package
Leadframe X Y
PG-DSO-36-24, -41, -42 A6901-C001 7 5.1
PG-DSO-36-38
A6901-C003 7 5.1
PG-DSO-36-38
A6901-C007 5.2 4.6
PG-DSO-36-24
A6901-C008 6.0 5.4
18 _X 1 Index Marking
Figure 44
1) Does not include plastic or metal protrusion of 0.15 max. per side
2) Does not include dambar protrusion of 0.05 max. per side
3) Distance from leads bottom (= seating plane) to exposed diepad
4) Exclunding the mold flash allowance of 0.3mm MAX per side
PG-DSO-36-24, -38, -41, -42-PO V08
PG-DSO-36-38 (Leadframe A6901-003);)
Note: For the SBC product family the package PG-DSO-36-38 with the leadframe A6901-C003 is used.
Green Product (RoHS compliant)
To meet the world-wide customer requirements for environmentally friendly products and to be compliant with
government regulations, the Universal System Basis Chip is available as a green product. Green products are
RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-
020).
For information about packages and types of packing, refer to the
Infineon Internet Page “Products”: http://www.infineon.com/products.
Data Sheet
91
Dimensions in mm
Rev. 1.0, 2009-03-31