TLE8262E Datasheet, PDF (9/93 Pages) Infineon Technologies AG – Universal System Basis Chip HERMES Rev. 1.0

TLE8262E
Pin Configuration
Pin Symbol
Function
26
RxD_LIN
LIN Transceiver Data Output; according to the ISO 9141 and LIN specification 2.1
as well as SAE J2602-2; push-pull output; LOW in dominant state.
27
n.c.
Not connected
28
n.c.
Not connected
29
n.c.
Not connected
30
n.c.
Not connected
31
GND
Ground
32
n.c.
Not connected
33
n.c
not connected
34
WK
Monitoring / Wake-Up Input; bi-level sensitive input used to monitor signals
coming from, for example, an external switch panel; also used as wake-up input;
35
Limp Home
Fail-Safe Function Output; Open drain. Active LOW.
36
Test
EDP -
SBC SW Development Mode entry; Connect to GND for activation; Integrated pull-
up resistor. Connect to V_S or leave open for normal operation.
Exposed Die Pad; For cooling purposes only, do not use it as an electrical ground.¹⁾
1) The exposed die pad at the bottom of the package allows better dissipation of heat from the SBC via the PCB. The exposed
die pad is not connected to any active part of the IC and can be left floating or it can be connected to GND for the best EMC
performance.
Data Sheet
9
Rev. 1.0, 2009-03-31