TLE8262E Datasheet, PDF (88/93 Pages) Infineon Technologies AG – Universal System Basis Chip HERMES Rev. 1.0

16.1
ZthJA Curve
TLE8262E
Application Information
60
Zth-JA(Ch4; 600)
50
Zth-JA(Ch4; 300)
Zth-JA(Ch4; 100)
40
Zth-JA(Ch4; footprint)
30
20
10
0
0,00001 0,0001 0,001
0,01
0,1
1
tim e (s)
Figure 41 ZthJA Curve, Function of Cooling Area
10
100
1000 10000
Zthja curves.vsd
600mm² cooling area
300mm² cooling area 100mm² cooling area
Figure 42 Board Set-up
Board set-up is done according to JESD 51-3, single layer FR4 PCB 70 µm.
Data Sheet
88
minimum footprint
PCB set up.vsd
Rev. 1.0, 2009-03-31