TLE8209-2 Datasheet, PDF (39/41 Pages) Infineon Technologies AG – SPI Programmable H-Bridge

TLE8209-2
12
Package Outlines TLE8209-2E
Package Outlines TLE8209-2E
0.35 x 45˚
7.6 _-0.2 ¹⁾
1.27
0.4 ±0.08 ²⁾
20
C
0.1 C 20x
0.25 M A-B C D 20x
0.7 ±0.2
10.3 ±0.3
D
A
11
Ejector Mark
Bottom View
Ejector Mark
11
Exposed Diepad
20
Index Marking
1
10
B
12.8 _-0.2 ¹⁾
10 ₇ 1 Index Marking
1) Does not include plastic or metal protrusion of 0.15 max. per side
2) Does not include dambar protrusion of 0.05 max. per side
PG-DSO-20-30-PO V01
Footprint:
0.65
7
1.27
PG-DSO-20-30-FP V01
Figure 23 PG-DSO-20-71 (Plastic Dual Small Outline Package)
Green Product (RoHS compliant)
To meet the world-wide customer requirements for environmentally friendly products and to be compliant with
government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e
Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).
You can find all of our packages, sorts of packing and others in our
Infineon Internet Page: http://www.infineon.com/packages
Data Sheet
39
Dimensions in mm
Rev. 1.4, 2014-10-28