TLE8209-2 Datasheet, PDF (38/41 Pages) Infineon Technologies AG – SPI Programmable H-Bridge

TLE8209-2
11
Package Outlines TLE8209-2SA
Package Outlines TLE8209-2SA
1.1^±0.1
11^±0.151)
B
2.8
15.74^±0.1
1.27 ^(Heatslug)
0.1
0.4 ^+0.13
0.25M A 20x
20
11
Index Marking
6.3
(Mold)
14.2 ^±0.3
Heatslug
0.95^±0.15
0.25B
Bottom View
11
20
1
1 x 45˚
10
15.9^±0.151)
A
(Mold)
10 _{13.7 -0.2} 1
(Meta)l
Heatslug
1)_{Does not include plastic or metal protrusion of 0.15 max. per side}
Footprint:
0.68
GPS05791
1.27
9 x 1.27 = 11.43
hlg09550
Figure 22 PG-DSO-20-65 (_{Plastic Dual Small Outline Package})
Green Product (RoHS compliant)
To meet the world-wide customer requirements for environmentally friendly products and to be compliant with
government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e
Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).
You can find all of our packages, sorts of packing and others in our
Infineon Internet Page: http://www.infineon.com/packages
Data Sheet
38
Dimensions in mm
Rev. 1.4, 2014-10-28