XC2734X Datasheet, PDF (105/106 Pages) Infineon Technologies AG – 16/32-Bit Single-Chip Microcontroller with 32-Bit Performance

XC2734X
XC2000 Family / Value Line
Package and Reliability
5.2
Thermal Considerations
When operating the XC2734X in a system, the total heat generated in the chip must be
dissipated to the ambient environment to prevent overheating and the resulting thermal
damage.
The maximum heat that can be dissipated depends on the package and its integration
into the target board. The “Thermal resistance R_ΘJA” quantifies these parameters. The
power dissipation must be limited so that the average junction temperature does not
exceed 150 °C.
The difference between junction temperature and ambient temperature is determined by
ΔT = (P_INT + P_IOSTAT + P_IODYN) × R_ΘJA
The internal power consumption is defined as
P_INT = V_DDP × I_DDP (switching current and leakage current).
The static external power consumption caused by the output drivers is defined as
P_IOSTAT = Σ((V_DDP-V_OH) × I_OH) + Σ(V_OL × I_OL)
The dynamic external power consumption caused by the output drivers (P_IODYN) depends
on the capacitive load connected to the respective pins and their switching frequencies.
If the total power dissipation for a given system configuration exceeds the defined limit,
countermeasures must be taken to ensure proper system operation:
• Reduce V_DDP, if possible in the system
• Reduce the system frequency
• Reduce the number of output pins
• Reduce the load on active output drivers
Data Sheet
105
V1.3, 2010-04