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HY29F080 Datasheet, PDF (7/38 Pages) Hynix Semiconductor – 8 Megabit (1M x 8), 5 Volt-only, Flash Memory
HY29F080
latched on the falling edge of WE# or CE#, which-
ever happens later. All data is latched on the ris-
ing edge of WE# or CE#, whichever happens first.
The ‘Device Commands’ section of this document
provides details on the specific device commands
implemented in the HY29F080.
Output Disable Operation
When the OE# input is at VIH, output data from the
device is disabled and the data bus pins are placed
in the high impedance state.
Standby Operation
When the system is not reading from or writing to
the HY29F080, it can place the device in the
Standby mode. In this mode, current consump-
tion is greatly reduced, and the data bus outputs
are placed in the high impedance state, indepen-
dent of the OE# input. The Standby mode can
invoked using two methods.
The device enters the CE# CMOS Standby mode
if the CE# and RESET# pins are both held at VCC
± 0.5V. Note that this is a more restricted voltage
range than VIH. If both CE# and RESET# are held
High, but not within VCC ± 0.5V, the device will be
in the CE# TTL Standby mode, but the standby
current will be greater.
The device enters the RESET# CMOS Standby
mode when the RESET# pin is held at VSS ± 0.5V.
If RESET# is held Low but not within VSS ± 0.5V,
the HY29F080 will be in the RESET# TTL Standby
mode, but the standby current will be greater. See
Hardware Reset Operation section for additional
information on the reset operation.
The device requires standard access time (tCE) for
read access when the device is in either of the
standby modes, before it is ready to read data. If
the device is deselected during erasure or pro-
gramming, it continues to draw active current until
the operation is completed.
Hardware Reset Operation
The RESET# pin provides a hardware method of
resetting the device to reading array data. When
the RESET# pin is driven Low for the minimum
specified period, the device immediately termi-
nates any operation in progress, tri-states the data
bus pins, and ignores all read/write commands for
Rev. 6.1/May 01
the duration of the RESET# pulse. The device also
resets the internal state machine to reading array
data. If an operation was interrupted by the as-
sertion of RESET#, it should be reinitiated once
the device is ready to accept another command
sequence to ensure data integrity.
Current is reduced for the duration of the RESET#
pulse as described in the Standby Operation sec-
tion above.
If RESET# is asserted during a program or erase
operation (RY/BY# pin is Low), the internal reset
operation is completed within a time of tREADY (during
Automatic Algorithms). The RY/BY# pin will go High
during the tREADY interval, and the system can per-
form a read or write operation after waiting for a mini-
mum of tREADY or until tRH after the RESET# pin re-
turns High, whichever is longer. If RESET# is as-
serted when a program or erase operation is not
executing (RY/BY# pin is High), the reset operation
is completed within a time of tRP. In this case, the
host can perform a read or write operation tRH after
the RESET# pin returns High.
The RESET# pin may be tied to the system reset
signal. Thus, a system reset would also reset the
device, enabling the system to read the boot-up
firmware from the Flash memory.
Sector Group Protect/Unprotect Operations
Hardware sector group protection can be invoked
to disable program and erase operations in any
single sector group or combination of sector
groups. This function is typically used to protect
data in the device from unauthorized or acciden-
tal attempts to program or erase the device while
it is in the system (e.g., by a virus) and is imple-
mented using programming equipment. Sector
group unprotection re-enables the program and
erase operations in previously protected sectors.
Table 1 identifies the eight sector groups and the
address ranges that each covers. The device is
shipped with all sector groups unprotected.
The sector group protect/unprotect operations re-
quire a high voltage (VID) on address pin A9 and
the CE# and/or OE# control pins, as detailed in
Table 3. When implementing these operations,
note that VCC must be applied to the device before
applying VID, and that VID should be removed be-
fore removing VCC from the device.
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