HY64UD16162M Datasheet, PDF (10/11 Pages) Hynix Semiconductor – 1M x 16 bit Low Low Power 1T/1C Pseudo SRAM

PACKAGE DIMENSION
48ball Fine Pitch Ball Grid Array Package(F)
A1 CORNER
INDEX AREA
TTOOPP VVIIEEWW
B
HY64UD16162M Series
BBOOTTTTOOMM VVIIEEWW
B1
A
A1 INDEX
MARK
C _C1
A
B
C
D
E
F
G
H
654321
A
C/2
5
C
E
SSIIDDEE VVIIEEWW
B/2
E1
E2 SEATING PLANE 4
A
R
3 D(DIAMETER)
Symbol
A
B
B1
C
C1
D
E
E1
E2
R
Min.
-
6.90
-
7.90
-
0.30
-
-
0.20
-
Typ.
0.75
7.00
3.75
8.00
5.25
0.35
1.00
0.75
0.25
-
unit : mm
Max.
-
7.10
-
8.10
-
0.40
1.10
-
0.30
0.08
NOTE.
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE MILLIMETERS.
3. DIMENSION “D” IS MEASURED AT THE MAXIMUM SOLDER
BALL DIAMETER IN A PLANE PARALLEL TO DATUM C.
4. PRIMARY DATUM C(SEATING PLANE) IS DEFINED BY THE
CROWN OF THE SOLDER BALLS.
5. THIS IS A CONTROLLING DIMENSION.
Revision 1.7
10
March. 2002