HDMP-1032 Datasheet, PDF (14/32 Pages) Agilent(Hewlett-Packard) – 1.4 GBd Transmitter/Receiver Chip Set with CIMT Encoder/Decoder and Variable Data Rate

HDMP-1032 (Tx) Thermal Characteristics
T_A = 25°C
Symbol
Parameter
θ_jc1
Thermal Resistance, Die to Case
P_D
Power Dissipation, V_CC = 3.3 V
Unit Typ.
°C/W 8
mW 590
HDMP-1034 (Rx) Thermal Characteristics
T_A = 25°C
Symbol
Parameter
θ_jc1
Thermal Resistance, Die to Case
P_D
Power Dissipation, V_CC = 3.3 V
Unit
Typ.
°C/W
8
mW
660
I/O Type Definitions
I/O Type
Definition
I-TTL
Input TTL. Floats high when left open.
O-TTL
Output TTL
HS_OUT
50 Ω Matched Output Driver. Will drive AC coupled 50 Ω loads. All unused outputs
should be AC coupled to a 50 Ω resistor to ground.
HS IN
High Speed Input
C
Filter Capacitor Node
S
Power Supply or Ground
Note:
1. Based on independent package testing by HP. θ_jc for the HDMP-1032 and HDMP-1034 is 50°C/W. θ_jc is measured on a standard
3" x 3" two layer PCB in a still air environment. In order to determine the actual junction temperature in a given application, use the following
formula: T_J = T_C + (θ_jc x P_D), where T_C is the case temperature measured on the top center of the package and P_D is the power being dissipated.
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